JORJIN / TI 2016 ICTS unveil 3D ToF image sensing chipset
1st - 5th November at National Exhibition and Convention Center (Shanghai) Jorjin jointly exhibited with Texas Instruments (TI) a new 3D Time-of-Flight ( ToF ) Image Sensor Chipset.
Internet of Things
With IOT overwheled Industrial fields, the world has moved from Industry 4.0 to IIOT; Industrial Internet of Things. Jorjin presents you System Solutions applind in IOT/IIOT.
Jorjin Module-Based in Automotive have Bluetooth/BLE/WiFi module.