WG7833-B0
2.4/5 GHz
WiFi & Bluetooth SiP Module
WG7833-B0
The Jorjin WG7833-B0 is a low cost 2.4/5 GHz WLAN + Bluetooth system in package (SiP) module based on the WL1833 SoC from Texas Instruments.
It contains a crystal, power amplifier, Tx filter and Tx/Rx switch as well as the necessary passive components to fully implement the 802.11a,b,g,n WiFi & Bluetooth 5.1 functions.
The WG7833-B0 WLAN is connected to the host processor via a 1.8V SDIO interface, and the Bluetooth is connected via a UART. Linux and Android drivers are provided for a wide range of application processors.
Key Features
WLAN, Bluetooth, BLE with integrated RF Front-End Module (FEM), Power Amplifier (PA), and power management on a single module
LGA106 pin package
Dimension 12.8mm x 12.0mm x 1.63mm
Provides efficient direct connection to battery by employing several integrated switched mode
Power supplies (DC2DC)
Seamless integration with TI Sitara™ and other application processors
WLAN and BT/BLE cores are software and hardware compatible with prior WL127x and WL128x offerings, for smooth migration to device
Shared HCI transport for BT/BLE over UART and SDIO for WLAN
Temperature detection and compensation mechanism ensures minimal variation in RF performance over the entire temperature range
BT 5.1, BLE and all audio processing features work in parallel and include full coexistence with WLAN
Operating temperature: -40°C ~ 85°C
Specification
Chipset
TI WL1833
WLAN
IEEE 802.11 a/b/g/n & BT 5.1
Certification
FCC/IC/CE/NCC/TELEC
Dimension (mm)
12.8 mm x 12.0 mm x 1.63 mm
Operating Temperature
-40°C ~ 85°C
Interface
SPI
Downloads
WG7833-B0
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